TI extends analog semiconductor manufacturing capacity into China
Significant capital investments enable TI to deliver the lead-times, volumes customers require
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TI has increased manufacturing capacity with the addition of a wafer fabrication facility in the Chengdu High Tech Zone in Chengdu, China.
The addition of this manufacturing facility and equipment provides TI a 200mm clean room capable of supporting more than $1 billion annually and a second clean room for future production capacity, further extending the companys ability to support the growth of its analog customers.
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While many TI competitors have reduced the size of their capital investments over the last few years, TI has made significant capital equipment and capacity expansions to support its comprehensive analog portfolio. These investments enable TI to deliver the lead-times, performance, volumes and low costs that our analog customers need throughout product life cycles, which can span anywhere from 5 to 20 years.
TI’s new Chengdu fab is the most recent in a series of analog manufacturing expansions by TI.
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